| 摘要 |
PURPOSE:To obtain an electronic-apparatus cooling system having high efficiency and high reliability by hermetically sealing both an apparatus proper and an auxiliary machine for fluidizing and cooling gas into a vessel and encapsulating a pressure gas kept at a low temperature into the vessel in an electronic apparatus forcibly cooling a semiconductor element by using the gas. CONSTITUTION:Packages 3 to be cooled, fans 4 and a heat exchanger 5 are received in a sealed vessel 6, an opening is bored to one wall surface of the vessel, and a compressor 7 is connected to the opening. An electric signal connector 8 is mounted to the base of the vessel 6, and a refrigerator 9 positioned on the outside is connected previously to the heat exchanger 5. According to such constitution, a gas pressured to required pressure by the compressor 7 is fluidized circulated in the vessel 6 by the fans 4, and heat generated in the packages 3 is absorbed to a gas flow. The heat is discharged by the heat exchanger 5 and the refrigerator 9, and electric signals from the packages 3 are transmitted over the outside from the connector 8. |
