| 摘要 |
PURPOSE:To provide a lead frame capable of avoiding the cracking in a resin due to the generated heat during the packaging step thereof especially on a printed board, etc., in relation to the lead frame having a die stage whereto a semiconductor chip fixed with a bonding material is to be sealed with a resin. CONSTITUTION:Within this lead frame composed of a die stage 21 whereto a semiconductor chip material fixed with a bonding material is to be sealed with a resin as well as support bars 23 holding this die stage 21, trenches 21a in parallel with the direction of the support bars 23 and reaching the same 23 are formed on the surface while films 21b having feeble bond strength onto a resin 33 are to be formed inside the trenches 21a.
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