| 摘要 |
<p>PURPOSE:To provide a semiconductor package and mounting method thereof capable of performing solder bonding step without fail. CONSTITUTION:In order to mount this semiconductor package 3 on a printed substrate 1, trench parts are formed on a part of the lead 4 of a semiconductor package 3 in the circumferential direction and then the printed substrate 1 is solder bonded so that the solder sucking up phenomenon may be suppressed thereby enabling solder bonding step to be performed without fail.</p> |
