发明名称 LEAD FRAME
摘要 PURPOSE:To execute bending process for overhanging to unwanted region of a lead frame to prevent increase of size in the resin sealing in a lead frame where a plurality of external connecting leads consisting of thin plate overhang an island formed of a thick plate. CONSTITUTION:In view of making a post portion 26 of second lead 22 overhang an island 18, a first bending process 24 is executed at the root portion of the island of a first lead 21 coupled with the island 18 and a second bending process 25 is then conducted to an unwanted portion which will be cut out after resin sealing of the first lead 21.
申请公布号 JPH06163786(A) 申请公布日期 1994.06.10
申请号 JP19920318541 申请日期 1992.11.27
申请人 SANYO ELECTRIC CO LTD 发明人 ANDO MAMORU
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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