| 摘要 |
PURPOSE:To provide a multilayer interconnection board manufacturing method using an additive process by which insufficient contact between inner-layer conductor circuits and a deposited metal on the internal surface of a through hole by plating can be surely reduced and, therefore, the connection reliability between them can be improved. CONSTITUTION:After forming insulating adhesive layers 2 on both surfaces of a substrate 1 in which inner-layer conductor circuits 1a are formed and boring a hole 3 for a through hole, Pd catalytic nuclei 4 are added to the internal surface and margins of the hole 3. At the time of adding the nuclei 4, the Pd ion concentration of an accelerator solution is maintained at <=1.2ppm. After washing the substrate 1 with water, the substrate 1 is dried under a reduced-pressure condition in a nitrogen atmosphere. After drying, a plating resist 6 is formed on the surface of the adhesive layer 2. After processing a hydrochloric acid having a Pd ion concentration of <=1.0ppm, the catalytic nuclei 4 are activated by using the accelerator solution of <=1.2ppm in Pd ion concentration. Thereafter, electroless copper plating is performed. When this method is used, no such a film that causes insufficient connection is formed at a junction. |
