| 摘要 |
PURPOSE:To provide a method by which a highly accurate laminate of ceramic wiring boards can be thermocompression bonded without fluctuating the distribu tion of shrinkage factor of sinter and the distortion of multilayer interconnection boards nor being affected by the variation of material lots and manufacturing conditions. CONSTITUTION:A top force 4a and bottom force 4b are constituted by forming the outer peripheral parts of the forces 4a and 4b in projecting shapes and central parts of the forces 4a and 4b in recessed shaped and a laminate 1A of green sheets is put between the forces 4a and 4b so as to form the outer peripheral part of the laminate 1A in a projecting shape and the central part of the laminate 1A in a recessed shape. At the time of thermocompression bonding the laminate 1A, the bonding pressure is made uniform on the surface of a substrate by raising the pressure at the outer peripheral part where the pressure is low and, on the contrary, lowering the pressure at the central part. |
