| 摘要 |
<p>PURPOSE:To prevent a sealing resin from being cracked by a method wherein the whole surface of a die pad is formed as a half-etched part, the thickness of the sealing resin is made thin and the concentration of a stress is dispersed. CONSTITUTION:A semiconductor chip 1 is mounted on, and fixed to, a die pad 2 for a lead frame by a conductive adhesive such as, e.g. a silver paste, and it is connected electrically to inner leads 4 by gold wires 3. The surface of the die pad 2 is formed as a half-etched part, and its rear is formed as a dimple-worked part in a continuous uneven shape which is composed of mountains and valleys. In addition, the semiconductor element 1 is sealed with a sealing resin 6 exclusive of outer leads 5, and a package for a semiconductor device is formed. The thickness of the sealing resin 6 is set to be thin as compared with that in conventional cases. In the thin package for the semiconductor device, it is possible to prevent a resin crack whose occurrence frequency is high and to increase reliability.</p> |
