| 摘要 |
FIELD: electricity. ^ SUBSTANCE: invention is related to semiconductor technology and may be used in microelectronics and optics in manufacture of plates from semiconductor and optical materials, particularly, from materials with higher hardness and brittleness, for instance, from sapphire. In method of plates manufacture from semiconductor and optical materials, which contains operations of single crystal calibration, preparation of basic cut, cutting of single crystal into plates, polishing of plates, preparation of face along plate edge, baking and polishing of plates, calibration of single crystal is carried out until diameter is 0.2/0.3 mm more than the nominal diameter of plates, and then plates are polished, and semi-round face is arranged along their edge by template with finishing of plates diameter to preset nominal value with simultaneous removal of edge microdents. ^ EFFECT: reduction of working hours spent for plates manufacture, reduction of expenses per tool, increase of efficiency. |
