发明名称 |
METAL FOIL WITH RESIN AND METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD USING THE SAME AND METHOD FOR PRODUCTION THEREOF |
摘要 |
<p>A metal-clad laminate or a metal foil with a resin which comprises a metal foil having both surfaces having been subjected to substantially no roughening treatment and an insulating resin composition layer using an insulating resin being generally employed; a printed wiring board using the metal-clad laminate or a metal foil with a resin; and a method for producing the printed wiring board. The printed wiring board is excellent in reliability and circuit formability and is significantly reduced in conductor loss.</p> |
申请公布号 |
KR20080094967(A) |
申请公布日期 |
2008.10.27 |
申请号 |
KR20087023803 |
申请日期 |
2008.09.29 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TAKAI KENJI;SUEYOSHI TAKAYUKI |
分类号 |
B32B15/08;B32B7/02;C23C28/00;H05K3/38;H05K3/46 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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