发明名称 METAL FOIL WITH RESIN AND METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD USING THE SAME AND METHOD FOR PRODUCTION THEREOF
摘要 <p>A metal-clad laminate or a metal foil with a resin which comprises a metal foil having both surfaces having been subjected to substantially no roughening treatment and an insulating resin composition layer using an insulating resin being generally employed; a printed wiring board using the metal-clad laminate or a metal foil with a resin; and a method for producing the printed wiring board. The printed wiring board is excellent in reliability and circuit formability and is significantly reduced in conductor loss.</p>
申请公布号 KR20080094967(A) 申请公布日期 2008.10.27
申请号 KR20087023803 申请日期 2008.09.29
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 TAKAI KENJI;SUEYOSHI TAKAYUKI
分类号 B32B15/08;B32B7/02;C23C28/00;H05K3/38;H05K3/46 主分类号 B32B15/08
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