发明名称 INJECTION MOLDING SYSTEM AND INJECTION MOLDING METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an injection molding system and an injection molding method, which make printing concurrently applied to an injection object during an injection process, and which enable the semipermanent preservation of a print image printed on the injection object. SOLUTION: The injection molding system comprises first and second molds for restricting a molding space for molding the injection object, and a printer for applying printing to one side of the injection object in a state in which the molding space is opened and in which the other side of the injection object is fixed to the first mold. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008254424(A) 申请公布日期 2008.10.23
申请号 JP20080023645 申请日期 2008.02.04
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 LEE DONG YUL;CHO TOSHO;SONG JUN GYU;LEE KYOUNG MIN
分类号 B29C45/16;B29C45/04;B29C45/32 主分类号 B29C45/16
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