发明名称 |
INJECTION MOLDING SYSTEM AND INJECTION MOLDING METHOD USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide an injection molding system and an injection molding method, which make printing concurrently applied to an injection object during an injection process, and which enable the semipermanent preservation of a print image printed on the injection object. SOLUTION: The injection molding system comprises first and second molds for restricting a molding space for molding the injection object, and a printer for applying printing to one side of the injection object in a state in which the molding space is opened and in which the other side of the injection object is fixed to the first mold. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2008254424(A) |
申请公布日期 |
2008.10.23 |
申请号 |
JP20080023645 |
申请日期 |
2008.02.04 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
LEE DONG YUL;CHO TOSHO;SONG JUN GYU;LEE KYOUNG MIN |
分类号 |
B29C45/16;B29C45/04;B29C45/32 |
主分类号 |
B29C45/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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