发明名称 |
PREPREG, MULTILAYER PRINTED WIRING BOARD AND ELECTRONIC PARTS USING THE SAME |
摘要 |
A prepreg is thermosettable. The prepreg comprises a thermosetting resin composition A, a cured resin of the thermosetting resin composition exhibiting a dielectric tangent of 0.005 or less under 1 Hz or more, and a substrate B into which the resin A is impregnated, wherein the substrate B comprises polyolefin fiber C and a fiber D, which has a tensile strength higher than that of the polyolefin fiber C and a thermal expansion coefficient smaller than that of the fiber C, and wherein the substrate is a woven cloth and has a solubility rate into a hydrocarbon organic solvent is less than 5 wt %.
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申请公布号 |
US2008261472(A1) |
申请公布日期 |
2008.10.23 |
申请号 |
US20080105328 |
申请日期 |
2008.04.18 |
申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
AMOU SATORU;SHIMIZU HIROSHI;HANAWA AKINORI |
分类号 |
B32B27/04;B32B5/02;D03D25/00 |
主分类号 |
B32B27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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