<p>Semiconductor device structures and methods of fabricating such semiconductor device structures for use in static random access memory (SRAM) devices. The semiconductor device structure comprises a dielectric region disposed between first and second semiconductor regions and a gate conductor structure extending between the first and second semiconductor regions. The gate conductor structure has a first sidewall overlying the first semiconductor region. The device structure further comprises an electrically connective bridge extending across the first semiconductor region. The electrically connective bridge has a portion that electrically connects a impurity-doped region in the first semiconductor region with the first sidewall of the gate conductor structure.</p>
申请公布号
WO2008125551(A1)
申请公布日期
2008.10.23
申请号
WO2008EP54235
申请日期
2008.04.08
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION;IBM UNITED KINGDOM LIMITED;MANDELMAN, JACK, ALLAN;YANG, HAINING