| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a fan-out type wafer level package structure that has satisfactory matching of a thermal expansion coefficient, is miniaturized, and has excellent reliability in a heat cycle test. <P>SOLUTION: A semiconductor device package comprises a substrate, having at least a die receiving through hole 106, a conductive connecting through hole structure, and a first connection pad 104 formed on both surfaces of a substrate 102. A die 106 is arranged in the die receiving through hole. A first member 110 is provided at the lower portion in the die. A second member 111 is provided at the lower portion in the die and is filled in a space formed between the die and the sidewall of the die reception through hole. Dielectric layers 116, 128 are formed in the die and on both surfaces of the substrate. Rewiring layers 118, 130 are formed on both surfaces and are connected to a contact pad. Protective layers 126, 132 are formed while covering the rewiring layers. <P>COPYRIGHT: (C)2009,JPO&INPIT |
