发明名称 INTERPOSER, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC CIRCUIT PACKAGE
摘要 <p><P>PROBLEM TO BE SOLVED: To prevent moisture absorption by a dielectric making up a capacitor of an interposer to provide an interposer exhibiting less electrical characteristics deterioration. <P>SOLUTION: The interposer includes substrates 11 and 12 formed as first layer and a second layer that are arranged parallel with each other, electrodes 13 and 14 made of conductors which are formed on the surfaces of the substrates 11 and 12 that are opposite to each other to have an irregular shape, respectively, a dielectric layer 15 sandwiched between the electrodes 13 and 14 formed respectively on the surfaces of the substrates 11 and 12 that are opposite to each other, a first conductive portion 16 which comes in from the external surface of the substrate 11 to penetrate the substrate 11 as the first layer to connect electrically to the electrode 14 formed on the opposite surface of the substrate 12, and a second conductive portion 17 which comes in from the external surface of the substrate 12 to penetrate the substrate 12 as the second layer to connect electrically to the electrode 13 formed on the opposite surface of the substrate 11. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2008258625(A) 申请公布日期 2008.10.23
申请号 JP20080095078 申请日期 2008.04.01
申请人 IBIDEN CO LTD 发明人 KONO SHUICHI;CHIN TOSHIMASU
分类号 H01L23/12;H01L23/32 主分类号 H01L23/12
代理机构 代理人
主权项
地址