| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrophoresis device and an electronic apparatus free of a risk of trouble such as cracking, chipping, a defect, etc., of a thin film circuit layer and therefore free of a risk of a decrease in reliability of the thin film circuit layer even when a connection end of a substrate for connection is electrically connected to the thin film circuit layer of the electrophoresis device. SOLUTION: This electrophoresis device has: a transparent substrate 1 and a circuit board 2 opposed to each other; a transparent electrode 3 formed on the transparent substrate 1; the thin film circuit layer 4 formed on the circuit board 2;an electrophoresis layer 5 sandwiched between the transparent substrate 1 and circuit board 2; and the substrate 6 for connection which is electrically connected to the thin film circuit layer 4 through conductive particles. Wherein, the total thickness t<SB>1</SB>of a wiring layer 21 of the substrate 6 for connection and the resin substrate 22 is less than the thickness t<SB>2</SB>of the electrophoresis layer 5. COPYRIGHT: (C)2009,JPO&INPIT
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