| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board and a semiconductor package, reduced in the warp of a semiconductor package even in a case when the semiconductor package is used in a thin type wiring board, and capable of coping with the miniaturization and high integration of electronic instruments. SOLUTION: The multilayer wiring board of this invention is provided with a core layer, a buildup layer which contains a fiber base, and a conductor circuit while the core layer is capable of forming an electric plating circuit and the buildup layer is constituted of at least a first resin layer, a second resin layer and the layer containing the fiber base, which is interposed between the first resin layer and the second resin layer, whereby the warp of the semiconductor package can be prevented effectively. COPYRIGHT: (C)2009,JPO&INPIT |
