| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting polyimide resin composition that obtains a cured material having excellent heat resistance, electrical characteristics, mechanical properties and dimensional stability and has excellent storage stability before curing and is publicly useful in the field of various heat-resistant coating materials, electrical insulating materials, and the like. SOLUTION: The thermosetting polyimide resin composition comprises a polyimide resin (A) having a structure represented by general formula (1) and/or general formula (2), wherein X is a residue after removal of a hydrogen atom from each of two phenolic hydroxy groups of a phenolic compound containing two or more phenolic hydroxy groups in one molecule, and an epoxy resin (B), and a phenoxy resin (C). COPYRIGHT: (C)2009,JPO&INPIT |
