发明名称 MOLDING DIE
摘要 PROBLEM TO BE SOLVED: To shorten the time of one cycle of molding from the heating to cooling of a die. SOLUTION: When cooling a die (1a, 1b) with a cooling unit (20a, 20b), a heating unit (10a, 10b) is evacuated from the rear surface of the die (1a, 1b), and a cooling unit (20a, 20b) is arranged at the rear surface of the die (1a, 1b). When heating the die (1a, 1b) by the heating unit (10a, 10b), the cooling unit (20a, 20b) is evacuated from the rear surface of the die (1a, 1b), and heating unit (10a, 10b) is arranged at the rear surface of the die (1a, 1b). Since the die can be efficiently heated to a required temperature in a short time while being able to cool the die to a required temperature efficiently in a short time, the time of one cycle of molding from the heating to cooling of the die can be shortened. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008254389(A) 申请公布日期 2008.10.23
申请号 JP20070101265 申请日期 2007.04.09
申请人 TOTOKU ELECTRIC CO LTD 发明人 YAMAGISHI AKIHIKO;HASHIZUME HIROTAKA;NAKAJIMA ATSUSHI
分类号 B29C33/02 主分类号 B29C33/02
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