发明名称 Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device
摘要 An adhesive sheet comprising a release substrate 10 , a substrate film 14 , and a first tacky-adhesive layer 12 placed between the release substrate 10 and the substrate film 14 , wherein an annular incision D is formed on the release substrate 10 from the surface of the first tacky-adhesive layer 12 side, the first tacky-adhesive layer 12 is laminated so as to cover the whole inner surface of the incision D in the release substrate 10 , and the incision D has a depth d of less than the thickness of the release substrate 10 and 25 mum or less.
申请公布号 US2008261039(A1) 申请公布日期 2008.10.23
申请号 US20080577255 申请日期 2008.02.14
申请人 发明人 TANAKA MAIKO;URUNO MICHIO;MATSUZAKI TAKAYUKI;FURUTANI RYOJI;MASHINO MICHIO;INADA TEIICHI
分类号 B32B7/12;H01L21/00;H01L23/495;H01L23/52 主分类号 B32B7/12
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