SEMICONDUCTOR LIGHT EMITTING DEVICE EXCELLENT IN HEAT RADIATION

摘要

A semiconductor light emitting device is provided which comprises: a semiconductor light emitting chip 2 mounted on a top surface 12 of a support plate 1 , wiring conductors 3 disposed adjacent to side surfaces 11 of support plate 1 , and a plastic encapsulant 6 for sealing side surfaces 11 of support plate 1 and wiring conductors 3 . Each of wiring conductors 3 has one end 13 electrically connected to an electrode 2 a of semiconductor light emitting chip 2 and the other end 14 extending away from support plate 1 . Plastic encapsulant 6 is formed with openings 7 upwardly extending from a bottom surface 6 b of plastic encapsulant 6 between side surface 11 of support plate 1 and an outer surface 6 c of plastic encapsulant 6 to open each bottom surface 3 b of wiring conductors 3 to the outside through opening 7 so that heat from semiconductor light emitting chip 2 can effectively be radiated to the outside through wiring conductors 3 and opening 7 when a large current is supplied to semiconductor light emitting chip 2 to turn it on with a high brightness.