发明名称 |
A HIGH HEAT CONDUCTIVE CIRCUIT SUBSTRATE |
摘要 |
A high heat conductive circuit substrate (10) includes: a metal substrate (20), an insulating layer (30) which is formed on the surface of the metal substrate (20), a first dielectric layer (40) which is formed on the surface of the insulating layer (30), a conductive layer (50) which is formed on the surface of the first dielectric layer (40). The conductive layer (50) is made up of a conductive media layer (52) and a main conductive layer (54). |
申请公布号 |
WO2008125009(A1) |
申请公布日期 |
2008.10.23 |
申请号 |
WO2008CN00732 |
申请日期 |
2008.04.10 |
申请人 |
COSMOS VACUUM TECHNOLOGY CORPORATION;HUANG, HSU-TAN;CHOU, CHUNG-LIN |
发明人 |
HUANG, HSU-TAN;CHOU, CHUNG-LIN |
分类号 |
H01L23/36;H05K1/05;H05K3/44;H05K7/20 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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