发明名称 A HIGH HEAT CONDUCTIVE CIRCUIT SUBSTRATE
摘要 A high heat conductive circuit substrate (10) includes: a metal substrate (20), an insulating layer (30) which is formed on the surface of the metal substrate (20), a first dielectric layer (40) which is formed on the surface of the insulating layer (30), a conductive layer (50) which is formed on the surface of the first dielectric layer (40). The conductive layer (50) is made up of a conductive media layer (52) and a main conductive layer (54).
申请公布号 WO2008125009(A1) 申请公布日期 2008.10.23
申请号 WO2008CN00732 申请日期 2008.04.10
申请人 COSMOS VACUUM TECHNOLOGY CORPORATION;HUANG, HSU-TAN;CHOU, CHUNG-LIN 发明人 HUANG, HSU-TAN;CHOU, CHUNG-LIN
分类号 H01L23/36;H05K1/05;H05K3/44;H05K7/20 主分类号 H01L23/36
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