DIE-ON-LEADFRAME (DOL) WITH HIGH VOLTAGE ISOLATION
摘要
A high voltage semiconductor module has a leadframe with spaced pads which is connected to a heat sink plate by a curable insulation layer on the top of the plate. Semiconductor die may be soldered to the leadframe pads before or after assembly to the plate. The insulation layer may be a curable epoxy or a B stage IMS plate.
申请公布号
WO2007130643(A9)
申请公布日期
2008.10.23
申请号
WO2007US10950
申请日期
2007.05.04
申请人
INTERNATIONAL RECTIFIER CORPORATION;HAUENSTEIN, HENNING, M.;MARCINKOWSKI, JACK;LIN, HENY