发明名称 CONDUCTIVE-SUBSTANCE-ADSORBING RESIN FILM, PROCESS FOR PRODUCING CONDUCTIVE-SUBSTANCE-ADSORBING RESIN FILM, METAL-LAYER-COATED RESIN FILM MADE FROM THE SAME, AND PROCESS FOR PRODUCING METAL-LAYER-COATED RESIN FILM
摘要 A conductive-substance-adsorbing resin film having a surface on which a conductive layer having excellent adhesion to the resin film and small irregularities at the interface with the resin film can be easily formed; a process for producing the resin film; a metal-layer-coated resin film which is obtained from the conductive-substance-adsorbing resin film and in which a highly precise wiring having excellent adhesion to the insulating resin film can be easily formed; and a process for producing a metal-layer-coated resin film which is a material capable of giving, by a simple method, a printed wiring board having a highly precise wiring. The conductive-substance-adsorbing resin film is composed of at least two resin layers, at least one of the resin layers being an adsorbent resin layer having the property of adsorbing a conductive substance or metal. The metal-layer-coated resin film can be obtained by adsorbing a metal onto this conductive-substance-adsorbing resin layer and then plating this layer.
申请公布号 WO2008126426(A1) 申请公布日期 2008.10.23
申请号 WO2008JP50247 申请日期 2008.01.11
申请人 FUJIFILM CORPORATION;TSURUMI, MITSUYUKI;UEKI, SHIKI 发明人 TSURUMI, MITSUYUKI;UEKI, SHIKI
分类号 B32B27/00;B32B15/08;C08J7/04;C23C18/16;C25D5/56;H05K1/03 主分类号 B32B27/00
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