发明名称 |
CONDUCTIVE-SUBSTANCE-ADSORBING RESIN FILM, PROCESS FOR PRODUCING CONDUCTIVE-SUBSTANCE-ADSORBING RESIN FILM, METAL-LAYER-COATED RESIN FILM MADE FROM THE SAME, AND PROCESS FOR PRODUCING METAL-LAYER-COATED RESIN FILM |
摘要 |
A conductive-substance-adsorbing resin film having a surface on which a conductive layer having excellent adhesion to the resin film and small irregularities at the interface with the resin film can be easily formed; a process for producing the resin film; a metal-layer-coated resin film which is obtained from the conductive-substance-adsorbing resin film and in which a highly precise wiring having excellent adhesion to the insulating resin film can be easily formed; and a process for producing a metal-layer-coated resin film which is a material capable of giving, by a simple method, a printed wiring board having a highly precise wiring. The conductive-substance-adsorbing resin film is composed of at least two resin layers, at least one of the resin layers being an adsorbent resin layer having the property of adsorbing a conductive substance or metal. The metal-layer-coated resin film can be obtained by adsorbing a metal onto this conductive-substance-adsorbing resin layer and then plating this layer. |
申请公布号 |
WO2008126426(A1) |
申请公布日期 |
2008.10.23 |
申请号 |
WO2008JP50247 |
申请日期 |
2008.01.11 |
申请人 |
FUJIFILM CORPORATION;TSURUMI, MITSUYUKI;UEKI, SHIKI |
发明人 |
TSURUMI, MITSUYUKI;UEKI, SHIKI |
分类号 |
B32B27/00;B32B15/08;C08J7/04;C23C18/16;C25D5/56;H05K1/03 |
主分类号 |
B32B27/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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