发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device including a plurality of semiconductor elements of different characteristics on a substrate with higher controllability and reduced cost. SOLUTION: The method of manufacturing a semiconductor device including the plurality of semiconductor elements on the substrate including a heating and controlling layer forming step to form, on the substrate, a heating and controlling layer having a plurality of regions with different amounts of heat radiation and heat conductivity and a heating step to heat the substrate forming the heating and controlling layer. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008258276(A) 申请公布日期 2008.10.23
申请号 JP20070096714 申请日期 2007.04.02
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 KAGEYAMA TATSUO
分类号 H01S5/026;H01L21/28;H01S5/22;H01S5/42 主分类号 H01S5/026
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