发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device including a plurality of semiconductor elements of different characteristics on a substrate with higher controllability and reduced cost. SOLUTION: The method of manufacturing a semiconductor device including the plurality of semiconductor elements on the substrate including a heating and controlling layer forming step to form, on the substrate, a heating and controlling layer having a plurality of regions with different amounts of heat radiation and heat conductivity and a heating step to heat the substrate forming the heating and controlling layer. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2008258276(A) |
申请公布日期 |
2008.10.23 |
申请号 |
JP20070096714 |
申请日期 |
2007.04.02 |
申请人 |
FURUKAWA ELECTRIC CO LTD:THE |
发明人 |
KAGEYAMA TATSUO |
分类号 |
H01S5/026;H01L21/28;H01S5/22;H01S5/42 |
主分类号 |
H01S5/026 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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