发明名称 |
CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS |
摘要 |
A method of providing connectivity to a microsized device, the method includes the steps of providing an ablative base material having at least a top surface; providing a die having a first and second surface and having bonding pads at least upon the first surface; placing the die with the at least first surface of the die contacting the at least first surface of the ablative base material; and ablating a channel in the ablative material proximate to the die.
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申请公布号 |
US2008258313(A1) |
申请公布日期 |
2008.10.23 |
申请号 |
US20070737187 |
申请日期 |
2007.04.19 |
申请人 |
ALI M ZAKI;STOLT A PETER;HAWKINS GILBERT A;STEPHANY THOMAS M |
发明人 |
ALI M. ZAKI;STOLT A. PETER;HAWKINS GILBERT A.;STEPHANY THOMAS M. |
分类号 |
H01L23/48;H01L21/58 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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