发明名称 |
TEMPERATURE SETTING METHOD FOR THERMAL PROCESSING PLATE, TEMPERATURE SETTING APPARATUS FOR THERMAL PROCESSING PLATE, AND COMPUTER-READABLE STORAGE MEDIUM |
摘要 |
A temperature setting method of the present invention includes the steps of: measuring states of an etching pattern within the substrate for a substrate for which a series of photolithography processing including thermal processing and an etching treatment thereafter have been finished; calculating temperature correction values for regions of a thermal processing plate from measurement result of the states of the etching pattern within the substrate using a function between correction amounts for the states of the etching pattern and the temperature correction values for the thermal processing plate; and setting the temperature for each of the regions of the thermal processing plate by each of the calculated temperature correction values.
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申请公布号 |
US2008257496(A1) |
申请公布日期 |
2008.10.23 |
申请号 |
US20080103276 |
申请日期 |
2008.04.15 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
JYOUSAKA MEGUMI;TADOKORO MASAHIDE;KONISHI YOSHITAKA;SHINOZUKA SHINICHI;OGATA KUNIE |
分类号 |
C23F1/00;G06F19/00;H01L21/027 |
主分类号 |
C23F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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