发明名称 TEMPERATURE SETTING METHOD FOR THERMAL PROCESSING PLATE, TEMPERATURE SETTING APPARATUS FOR THERMAL PROCESSING PLATE, AND COMPUTER-READABLE STORAGE MEDIUM
摘要 A temperature setting method of the present invention includes the steps of: measuring states of an etching pattern within the substrate for a substrate for which a series of photolithography processing including thermal processing and an etching treatment thereafter have been finished; calculating temperature correction values for regions of a thermal processing plate from measurement result of the states of the etching pattern within the substrate using a function between correction amounts for the states of the etching pattern and the temperature correction values for the thermal processing plate; and setting the temperature for each of the regions of the thermal processing plate by each of the calculated temperature correction values.
申请公布号 US2008257496(A1) 申请公布日期 2008.10.23
申请号 US20080103276 申请日期 2008.04.15
申请人 TOKYO ELECTRON LIMITED 发明人 JYOUSAKA MEGUMI;TADOKORO MASAHIDE;KONISHI YOSHITAKA;SHINOZUKA SHINICHI;OGATA KUNIE
分类号 C23F1/00;G06F19/00;H01L21/027 主分类号 C23F1/00
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