发明名称 A METHOD FOR FABRICATING A CONTACT GRID ARRAY
摘要 A scalable, low cost, reliable, compliant, low profile, low insertion force, high-density, separable and reconnectable connector for high speed, high performance electronic circuitry and semiconductors. The electrical connector can be used to make, for example, electrical connections from components such as a Printed Circuit Board (PCB) to another PCB, MPU, NPU, or other semiconductor device. A normalized working range for an array of elastic contacts of the interposer can be about 0.2 to 1.0. A reversible normalized working range is maintained through multiple connections and reconnections using a highly elastic material for the contact arms. In one aspect, a first electrical component having a first array pitch can be connected to a second electrical component having a second array pitch.
申请公布号 WO2007143115(A3) 申请公布日期 2008.10.23
申请号 WO2007US12979 申请日期 2007.06.01
申请人 NEOCONIX, INC.;WILLIAMS, JOHN D. 发明人 WILLIAMS, JOHN D.
分类号 H01R12/00 主分类号 H01R12/00
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