LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF, SURFACE LIGHTING APPARATUS HAVING THEREOF

摘要

A light emitting diode package is provided to reduce optical loss in a cavity and improve a central light intensity by forming a reflection plate of a U shape in a cavity of a package body. A package body(110) is prepared in which a cavity(117) is formed. A reflection plate(112,114) of a U shape is formed in the cavity. A light emitting diode(120) is mounted on the reflection plate. The reflection plate can be made of a plurality of reflection plates. The plurality of reflection plates can be electrically separated from each other in the cavity, penetrating the package body to form an external electrode(113).