| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure capable of making earth potential surely conductive to a shielding layer and capable of lowering a height and reducing the size of an electronic component apparatus in which a plurality of electronic components are mounted to the wiring board and are covered with insulating rein molded structure, and the earth potential is applied to the surface of the insulating resin molded body to form a shielding layer. SOLUTION: A conductive surface 21 is formed on the upper surface of a high height electronic component 8 having a minimum height direction size among a plurality of electronic components 8 to 10 mounted to the wiring board 2. The conductive surface 21 is electrically connected with a terminal electrode 19 connected with a connection conductive land 4(A) having wearing electric potential and exposed from an insulating resin molded body 22 so as to be conductive with the shield layer 23. COPYRIGHT: (C)2009,JPO&INPIT
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