发明名称 SUBSTRATE TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To make it possible to manufacture a product stably and improve its productivity even when increasing an actual period of maintenance operation and repeating heat treatment are applied. SOLUTION: A substrate treatment apparatus includes a reaction room which holds a substrate, a heating means which heats the reaction room, and a temperature sensor which measures the temperature in the reaction room and controls the heating means based on the temperature detected by the temperature sensor to control the temperature. The temperature control is carried out in a manner such that a relation between an actual accumulated value of performed substrate treatment and an error of the temperature detected in the reaction room by the temperature sensor is obtained, the relation is stored as an aging error, and a correction is made by using the aging error correspondent to the actual accumulated value to make the temperature control. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008258534(A) 申请公布日期 2008.10.23
申请号 JP20070101642 申请日期 2007.04.09
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 TANAKA KAZUO
分类号 H01L21/205;C23C16/52;H01L21/22;H01L21/324 主分类号 H01L21/205
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