| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing the movement of foreign substance, detecting conductive foreign substance on printed wiring at high sensitivity, and suppressing increase in a defect rate after shipping the semiconductor device. SOLUTION: The semiconductor device is provided with a semiconductor chip, a substrate 12 on which the semiconductor chip is mounted, a plurality of wires 13 formed on the substrate 12, connecting one end to the semiconductor chip and connecting the other end to an external wire, and a plurality of subwires 15 arranged on the substrate 12 in parallel with respective wires 13 and electrically separated from respective adjacent wires 13. COPYRIGHT: (C)2009,JPO&INPIT
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