摘要 |
A printing platform receives (102) (preferably in-line with a semiconductor device printing process (101)) a substrate having at least one semiconductor device printed thereon and further having a test structure printed thereon, which test structure comprises at least one printed semiconductor layer. These teachings then provide for the automatic testing (103) of the test structure with respect to at least one static (i.e., relatively unchanging) electrical characteristic metric. The static electrical characteristic metric (or metrics) of choice will likely vary with the application setting but can include, for example, a measure of electrical resistance, a measure of electrical reactance, and/or a measure of electrical continuity. Optionally (though preferably) the semiconductor device printing process itself is then adjusted (105) as a function, at least in part, of this metric.
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申请人 |
MOTOROLA INC.;BRAZIS, PAUL, W.;GAMOTA, DANIEL, R.;KALYANASUNDARAM, KRISHNA;ZHANG, JIE;JONNALAGADDA, KRISHNA, D. |
发明人 |
BRAZIS, PAUL, W.;GAMOTA, DANIEL, R.;KALYANASUNDARAM, KRISHNA;ZHANG, JIE;JONNALAGADDA, KRISHNA, D. |