METHOD AND APPARATUS FOR CLEANING SUBSTRATE

摘要

A substrate cleaning method and a substrate cleaning apparatus are provided to perform rapidly a pressure control process by using a natural exhaust process and a compulsive exhaust process. A substrate is guided into a cleaning chamber(S110). The substrate is cleaned under first pressure within a cleaning chamber by using a supercritical fluid(S120). The pressure of the cleaning chamber is adjusted by the second pressure lower than the first pressure(S130). The second pressure is changed to the third pressure lower than the second pressure by performing a compulsive exhaust process for the cleaning chamber(S140). The substrate is drawn from the cleaning chamber under the third pressure(S150). A vacuum state is formed in the cleaning chamber before the compulsive exhaust process for the cleaning chamber.