MANUFACTURING METHOD OF POLISHING PAD, POLISHING PAD, AND POLISHING METHOD OF WAFER

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method or the like of a polishing pad capable of stably obtaining a wafer having high flatness.

SOLUTION: The manufacturing method of the polishing pad which is made of foam urethane pad and used for polishing the wafer by being attached to a platen is characterized in that it has a process which slices at least a foam urethane cake to make the foam urethane pad, and a process which presses the foam urethane pad at the pressure of 15000g/cm2or more.

COPYRIGHT: (C)2009,JPO&INPIT