发明名称 |
SUBSTRATE AND ITS MANUFACTURING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To increase an airtightness surrounding a penetrative electrode. <P>SOLUTION: A substrate 101 is provided with a housing part 101C defined by a base 101A for packaging a luminescent element 102 and a wall part 101B erecting on the base 101A. A package 100 is configured in such a way that an upper end of the wall part 101B formed so as to surround a periphery of the housing part 101C is jointed to a cover 103 to seal the luminescent element 102. A sealing structure 130 is composed of: a recessed part 140 formed on a surface on the rear side of the base 101A; an adherent layer 150 laminated on a surface of this recessed part 140; a feed layer 160 laminated on the adherent layer 150, and an electrode layer 170 laminated on a surface of the feed layer 160. The recessed part 140 has: a first cavity 180 formed at a location apart radially from an outer periphery of a penetrative electrode 107 or an inner wall of a through hole 120; and a second cavity 190 formed at a location far apart toward the more outer side than the first cavity 180. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2008258322(A) |
申请公布日期 |
2008.10.23 |
申请号 |
JP20070097614 |
申请日期 |
2007.04.03 |
申请人 |
SHINKO ELECTRIC IND CO LTD |
发明人 |
SHIRAISHI AKINORI;MURAYAMA HIROSHI;HARUHARA MASAHIRO;KOIZUMI NAOYUKI;AZUMA MITSUTOSHI |
分类号 |
H01L23/04;H01L23/12;H01L33/22;H01L33/62 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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