| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate with a built-in coil which allows a large current to flow a flat coil conductor, with no mulfunction of a mounted IC which is caused by the heat generated at the flat coil conductor. <P>SOLUTION: The substrate with a built-in coil comprises a substrate comprising a pair of insulating layers 1/1 where a wiring layer 6 is formed and a ferrite magnetics layer 2 pinched by the pair of insulating layers 1/1, and a flat coil conductor 3 formed in the ferrite magnetics layer 2. A heat transfer conductor layer 4 is formed from the outside of the flat coil conductor 3 to the side surface of the substrate, in plan view, and the heat transfer conductor layer 4 is connected to a heat radiation conductor layer 5 formed on the side surface of the substrate. The heat generated at the flat coil conductor 3 can be released to the outside from the heat radiation conductor layer 5 through the heat transfer conductor layer 4. As a result, the electronic components such as a mounted IC is prevented from mulfunctioning by the heat generated from the flat coil conductor 3. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
