| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which solves the problem of deterioration in connection reliability after mounting by reduction of an extreme copper erosion due to soldering of a footprint without an additional production process including nickel plating, etc. SOLUTION: A printed wiring board includes wiring pattern parts having through-holes and a plurality of footprint parts except a power source layer and a grounding layer. The printed wiring board includes heat release through-holes adjacent to the footprint parts, and the footprint parts and the heat release through-holes are connected by the wiring pattern parts. COPYRIGHT: (C)2009,JPO&INPIT
|
