发明名称 |
Method of chemical mechanical polishing of a copper structure using a slurry having a multifunctional activator |
摘要 |
The present invention relates to aqueous slurry/solution compositions for the Chemical Mechanical Polishing/Planarization ("CMP") of substrates. In particular, the novel slurries/solutions of the present invention contain a multifunctional activator which provides increased copper removal rate to the aqueous polishing slurry/solution while suppressing isotropic chemical etch and dishing of copper lines.
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申请公布号 |
US2008257862(A1) |
申请公布日期 |
2008.10.23 |
申请号 |
US20080166765 |
申请日期 |
2008.07.02 |
申请人 |
BELOV IRINA;MOSER TIMOTHY D |
发明人 |
BELOV IRINA;MOSER TIMOTHY D. |
分类号 |
C23F1/02;B44C1/22 |
主分类号 |
C23F1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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