METHOD AND APPARATUS FOR TESTING SYSTEM-IN-PACKAGE DEVICES, MICRO SD DEVICES

摘要

A method for testing system-in package devices (105) with a plurality of electric leads includes: placing the system-in-package devices (105) on a JEDEC load tray (101), forming a load tray stack, determining the direction of the load tray, providing a test holder (1300) with test circuits which correspond to the number of collecting slots (103) and provide a plurality of test joint groups, moving the load tray (101) so as to achieve synchronously the electric connection between each group of said test joint groups and said electric lead of corresponding group of the system-in package devices (105) which are placed in said collecting slots (103) and test synchronously.