发明名称 SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment method capable of improving processing efficiency by generating a remarkable change on a substrate surface in substrate treatment by a treatment fluid, and a substrate treatment apparatus. SOLUTION: To the mixing part 40 of a mixing valve 4, chemical undiluted solutions from chemical supply sources 71-74 and normal temperature pure water and warm pure water from a pure water supply source can be supplied. A treatment liquid is supplied from the mixing valve 40 through a treatment liquid supply path 3 to a treatment liquid nozzle 2, and the treatment liquid is supplied to a substrate W. During the treatment of the substrate W by the treatment liquid, a fluctuation is imparted to a process parameter by the control of liquid introduction valves 41-44, flow rate adjustment valves 101-104, a pure water supply source valve 51, a warm pure water supply source valve 52 and a pure water valve 5, etc. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008258437(A) 申请公布日期 2008.10.23
申请号 JP20070099633 申请日期 2007.04.05
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 ARAKI HIROYUKI
分类号 H01L21/304;B08B3/02;B08B3/10;G02F1/13;G02F1/1333;H01L21/027;H01L21/306 主分类号 H01L21/304
代理机构 代理人
主权项
地址