| 摘要 |
PROBLEM TO BE SOLVED: To provide a forming method of a patterned conductor layer capable of forming a minute patterned conductor layer without using metal particles while reducing the number of photolithography steps and etching steps. SOLUTION: The forming method of the patterned conductor layer has a coating film forming step (S1) of coating a coating liquid containing a polyimide precursor resin, a metal compound and a viscosity control agent on the surface of an insulating substrate by using a dispenser, and drying it to form a predetermined coating film; a reducing step (S2) of allowing a reducing agent to act on metal ions in the coating film to reduce the metal ions, and precipitating particle-like metal into the coating film; a non-electrolyte plating step (S3) of executing non-electrolytic plating to the coating film in which the particle-like metal is precipitated to form a non-electrolytic plating layer being a patterned conductor layer; and an imidizing step (S4) of performing heat treatment to imidize the polyimide precursor resin in the coating film, thereby forming a polyimide resin layer. COPYRIGHT: (C)2009,JPO&INPIT
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