| 摘要 |
PROBLEM TO BE SOLVED: To provide a forming method of a conductor layer capable of forming a conductor layer excellent in bonding strength with an insulative base material without requiring a non-electrolytic plating step. SOLUTION: The forming method of the conductor layer has a coating film forming step (S1) of coating a coating liquid containing a polyimide precursor resin and a metal compound on the surface of an insulative base material, and drying it to form a coating film; a first reducing step (S2) of immersing the insulative base material into a solution containing a reducing agent to precipitate a particle-like metal on the coating film; an immersion step (S3) of immersing the insulative base material into a solution containing a metal compound; and a second reducing step (S4) of re-immersing the insulative base material into a solution containing the reducing agent after the immersion step to precipitate the particle-like metal into the coating film, thereby forming a metal precipitation layer as the conductor layer; and an imidizing step (S5) of performing heat treatment to imidize the polyimide precursor resin in the coating film to form a polyimide resin layer. COPYRIGHT: (C)2009,JPO&INPIT
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