| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate-joining device enabling uniform junction over the entire surface of a substrate while preventing an air sump from being formed between joined substrates. SOLUTION: The substrate-joining device has: a first substrate-holding means (101) for holding a first set of substrates (W1); a second substrate-holding means (201) for holding a second set of substrates (W2); a pressuring means (250) for allowing force to operate on the first and second substrate-holding means so that the substrates are joined; and a control means (300) for controlling the force. In at least one of the first and second substrate-holding means, there is a projection in a region except at least one portion of the periphery of a surface holding the substrate, the portion of the substrate corresponding to the projection abuts first when the first and second sets of substrates are joined, and then a contact area on the substrate widens gradually. The control means controls the force according to the contact area. COPYRIGHT: (C)2009,JPO&INPIT |
