| 摘要 |
PROBLEM TO BE SOLVED: To suppress generation of loss of material and cost by minimizing the amount of used resin exceeding the amount of resin actually applied to a surface to be coated when a liquid resin is applied to the surface or back of a circular substrate of a semiconductor wafer or the like. SOLUTION: The wafer (substrate) 1 is concentrically held on a chuck table 20 so that the surface to be coated faces upward. A slot die 60 is arranged above and opposite to the wafer 1 so that the slot 62 of the slot die 60 is made to correspond to the radius of the wafer 1. While rotating the chuck table 20 to rotate the wafer 1, resin is discharged from the slot 62 to be applied to the surface to be coated of the wafer 1. The slot 62 does not extend, or extends very slightly from the surface to be coated of the wafer 1, which minimizes the amount of resin loss. COPYRIGHT: (C)2009,JPO&INPIT
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