发明名称 |
WAFER DICING USING A FIBER MOPA |
摘要 |
Silicon wafer dicing apparatus includes a master oscillator power amplifier (MOPA) arrangement wherein the master oscillator includes a continuous wave (CW) laser the output of which modulated by an external modulator to provide optical pulses to be amplified in the power amplifier. In one example of the apparatus the power amplifier includes at least one amplification stage including an optical fiber gain-medium.
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申请公布号 |
US2008261382(A1) |
申请公布日期 |
2008.10.23 |
申请号 |
US20080045519 |
申请日期 |
2008.03.10 |
申请人 |
STARODOUMOV ANDREI;HODGSON NORMAN;HANNON TERRY |
发明人 |
STARODOUMOV ANDREI;HODGSON NORMAN;HANNON TERRY |
分类号 |
H01L21/02;B23K26/16 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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