METALLIC FOIL-CLAD LAMINATE PLATE AND PRINTED WIRING BOARD

摘要

This invention provides a metallic foil-clad laminate plate comprising a substrate and a metallic foil provided in contact with the substrate, the substrate comprising two or more composite resin layers, stacked on top of each other, each comprising a fibrous base material impregnated with a resin composition. In this metallic foil-clad laminate plate, at least two opposed composite resin layers have been bonded to each other with the aid of an adhesive layer formed of a resin composition, and the resin composition in the composition resin layer and the adhesive layer has been cured. The metallic foil-clad laminate plate can maintain a highh-temperature surface hardness on a level high enough to conduct wire bonding while maintaining a large amount of the resin in the metallic foil-clad laminate plate. There is also provided a printed wiring board having the above advantageous properties.