| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus and method by which a process of surface treatment and thermal processing can be performed without exchanging an executing device. <P>SOLUTION: The laser beam machining apparatus 1 is equipped with: a laser oscillator 3 for emitting a thermal processing laser beam of continuous wave or pulsed wave, or a surface-treatment laser beam of pulsed wave; an incident optical system 4 for making the laser beam emitted from the laser oscillator 3 enter an optical fiber 5; a condenser lens 6 for condensing the laser beam emitted from the optical fiber 5; and the executing device 7 that moves near a target workpiece B, with the condenser lens 6 loaded, and that irradiates the surface of the workpiece B with the laser beam. The laser oscillator 3 is characterized in that it emits the thermal processing laser beam in performing thermal processing, and that it emits the surface-treatment laser beam in performing the pre- or post-processing of this thermal processing. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
