| 摘要 |
PROBLEM TO BE SOLVED: To prevent generation of sludge due to increase in the concentration of a solder resist, in a developing solution for a solder resist and to prevent re-deposition of sludge onto a substrate made of copper or the like or deposition on a developing tank. SOLUTION: The developing solution for a solder resist contains (A) a diluted alkali aqueous solution, and (B) an ester of polyoxyalkylene fatty acid expressed by formula shown and having an average molecular weight of 1,000 to 10,000, by 0.001 to 2.0 wt.%. In the formula, R1CO represents a 10-22C acyl group; R2 represents a hydrogen atom or a 10-22C acyl group; EO represents an oxyethylene group; PO represents an oxypropylene group; each of X and Y, independently represents an integer of 5 to 200; and the oxyethylene group and the oxypropylene group may be in a form of random polymerization or block polymerization. COPYRIGHT: (C)2009,JPO&INPIT |
