发明名称 |
SINGLE-WAFER TYPE SUBSTRATE TREATMENT APPARATUS, OPERATING METHOD OF SINGLE-WAFER TYPE SUBSTRATE TREATMENT APPARATUS AND STORAGE MEDIUM |
摘要 |
PROBLEM TO BE SOLVED: To provide a technology capable of alleviating a problem of insufficient carrier placing portions in a carry-in port while avoiding an increase in foot print in a substrate treatment apparatus equipped with a plurality of single-wafer type treatment modules. SOLUTION: The substrate treatment apparatus 3 is provided with the single-wafer type treatment modules 34a-34d; a substrate transfer chamber 31 provided with a substrate transfer means 31a; a carry-in port 1 having first placement tables 10a arranged in a horizontal direction for placing a housing container CA in an access region of the substrate transfer means 31a; a second placement table installed on an extension line of an arrangement region of the first placement tables 10a and used for temporarily placing the housing container CA; and a transfer means 2 for transferring the housing container CA from the second placement table to one of the first placement tables 10a. The outer end of the horizontal direction of the second placement table 10b is positioned inside a vertical direction of the outer end positioned outside of the outer ends of the horizontal direction of the maintenance region of the treatment apparatus 3 and outer ends of the horizontal direction of the treatment modules 34a-34d. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2008258192(A) |
申请公布日期 |
2008.10.23 |
申请号 |
JP20070095399 |
申请日期 |
2007.03.30 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
KONDO KEISUKE;OSADA MAKOTO |
分类号 |
H01L21/677;H01L21/02 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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