| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of coating application on a substrate, a coating application apparatus for the substrate and a computer readable storage medium, for uniformly applying a resist liquid on the surface of a wafer. SOLUTION: In the coating step S3, the wafer W is rotated at high speed, and while maintaining the condition, the resist liquid is spouted through a first nozzle 143 onto a central area of the wafer W to thereby attain application of the resist liquid onto the wafer W. In the subsequent planarizing step S4, the rotating speed of the substrate is decreased and the resist liquid on the wafer substrate is planarized by rotating the wafer W at low speed. The spouting of the resist liquid through the first nozzle 143 in the coating step S3 is continued until the middle of the planarizing step S4. In the discontinuation of the spouting of the resist liquid in the planarizing step S4, the first nozzle 143 is shifted to thereby shift the position of spouting of the resist liquid from the central area of the wafer W. In a drying step S5, the speed of the rotation of the wafer W is increased to dry the resist liquid on the wafer W. COPYRIGHT: (C)2009,JPO&INPIT
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